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Dr. Goodarz Ahmadi
Director, TMFL
Clarkson U.
Potsdam, NY 13699

 Research Projects
Aerosol Wind Tunnel | Boiler | Charged Fibers | Charged Particles | CMP | CO2 Sequestration | Coal Ash Deposition | CRCD | Cryogenic Surface Cleaning | DNS | Fractured Rocks | Gas Hydrates | Glass Furnaces | Hot Gas Filtration | Indoor Air | Lung | Nano Aerosols | Outdoor Air | Particle Resuspension | Powder Dispersion | Bauxite Residue | Sediment Transport | Slurry Reactors | Sprays | Supersonic Impactors | Vibration Control | Reduced Order Modeling |

Modeling the Chemical-Mechanical Polishing Process

-Chemical-Mechanical Polishing-

With circuit dimensions approaching to 0.35 mm and smaller, planarization has become a requirement for chip manufacturing. The targeted goal is to achieve planarity across the wafer a maximum surface elevation difference less than 0.15 mm or smaller. For this purpose, the chemical-mechanical polishing (CMP) has become a widely used technology for planarization of multilevel interconnects in microelectronic industry. The general procedure is to rotate a wafer against a polishing pad in the presence of pressurized slurry. The slurry typically consists of abrasive particles in an alkaline medium. It is now well recognized that the slurry feed rate, velocity, pressure, temperature, and PH, as well as abrasive particle size and material, and pad elasticity and hardness have profound effects on the effectiveness of chemical-mechanical polishing. Despite extensive usage of CMP, the microscopic processes that control the performance of chemical-mechanical polishing are far from being understood. Therefore, optimization and control of CMP cannot be properly achieved. The goal of this research project is to provide the needed fundamental understanding of the particle-scale removal processes that leads to the surface planarization during the chemical-mechanical polishing. We also plan to develop a reliable model for the rate of surface removal during the CMP process as a function of abrasive particle physical characteristics, chemical property of the slurry, as well as pad mechanical parameters. The result of the model will be useful for optimizing the chemical-mechanical polishing process in various applications.

Funded by NYSTAR through Center for Advanced Materials Processing (CAMP)

-New York STAR- -Center for Advanced Materials Processing-

Questions or Comments should be addressed to the Lab Director, Dr. Goodarz Ahmadi

Dr. Goodarz Ahmadi | Turbulence & Multiphase Fluid Flow Laboratory | Department of Mechanical & Aeronautical Engineering
Copyright © 2000-2006 Dr. Goodarz Ahmadi. All rights reserved.
Potsdam, New York, 13699