Ian Suni
Professor
Chemical and Biomolecular Engineering
236 CAMP
Clarkson University
PO Box 5705
Potsdam, NY 13699-5705
Phone: 315-268-4471
E-mail: isuni@clarkson.edu
Research Web
site
Educational Background
Ph.D., Harvard University (1992)
B.S., University of Michigan (1983)
Research Interests
- Metal Coatings by Electrodeposition and Electroless Deposition
- ULSI Processing of Cu and Ta
- Biosensors
- Nanomaterials
Member
- American Institute of Chemical Engineers
- American Society for Engineering Education
- American Association for the Advancement of Science
- American Chemical Society
- Materials Research Society
- Tau Beta Pi
A. Tripathi, J. Wang, L.A. Luck and I.I. Suni, "Nanobiosensor Design Utilizing a Periplasmic E. coli Receptor Protein Immobilized within Au/Polycarbonate Nanopores", Anal. Chem.
79, 1266 (2007).
J. Wang, J.A. Profitt, M.J. Pugia and I.I. Suni, “Au Nanoparticle Conjugation for Impedance and Capacitance Signal Amplification in Biosensors,” Anal. Chem.78, 1769 (2006).
B. Du and I.I. Suni, “Electrochemcal Dissolution of Ta and TaN Diffusion Barriers,” Electrochem. Solid-State Lett.8, G283 (2005).
B. Du and I.I. Suni, “Cu Planarization for ULSI Processing by Electrochemical Methods: A Review,” IEEE Trans. Semicond. Manuf.18, 341 (2005).
J. Wang, K.A. Carmon, L.A. Luck and I.I. Suni, "Impedance biosensor for glucose detection utilizing an E. coli receptor protein," Electrochem. Solid-state Lett. 8, H61 (2005).
S. Sapra, H. Li, Z. Wang and I.I. Suni, " Voltammetry and impedance studies of Ta in aqueous HF," J. Electrochem. Soc. 152, B193 (2005).
B. Du and I.I. Suni, "Water diffusion coefficients during Cu electropolishing," J. Appl. Electrochem. 34, 1215 (2004).
B. Du and I.I. Suni, "Mechanistic studies of Cu electropolishing in phosphoric acid electrolytes,"J. Electrochem. Soc. 151, C375 (2004).
Z. Wang, H. Li, H.H. Shodiev and I.I. Suni, "Immersion/electroless deposition of Cu onto Ta," Electrochem. Solid- State Lett. 7, C67 (2004).
H. Lin, A.A. Busnaina and I.I. Suni, "Investigation of ionic contamination removal from silicon dioxide surfaces," Surf. Engin. 18, 233 (2002).
